HDI板盲孔盘无铜探讨

HDI board blind hole PAD no copper is discussed

埋盲孔常规PCB走向更高密度的HDI/BUM板的必由之路,传统PCB板导孔难以胜任其基层(a+n+b,n为芯板的层数,a和b为高密度积层的层数)的层数越来越多结构产品,必须运用仅在需要电气互连的相关的内层之间才有导通孔的埋/盲孔进行导通;而盲孔品质直接关系产品导通性能;文章根据我司出现盲孔焊盘无铜现象进行理论分析,通过对PCB板从问题分析、过程、影响的因素几个方面进行了详细的分析。最后对如何在生产过程中进行管理给出了建议。

according to a higher density of conventional PCB HDI/BUM the only way of the board, the traditional PCB guide hole are not suitable for the basic （a ＋ n ＋ b, n for core board level number, a and b for high density product layer layer） layer of more and more products structure, must use only in need of the lining of the related electrical interconnection between the hole have buried/blind holes for conduction; And blind hole quality directly related products conduction performance; According to our company appear blind hole PAD no copper theoretical analysis on the phenomenon, through to the PCB board from problem analysis, process, the influence factors of a detailed analysis. Finally in the production process of how to manage the Suggestions are given.