氯离子控制、铜球保养与电镀线事故之探讨

Analysis on the cause of a fire accident on copper plating line

当PCB制程中的电镀工艺控制存在管控不当时,会导致生产、品质问题的出现,甚至会酿成火灾事故。本文主要通过对一起品质、火灾事故的原因分析,阐述了电镀溶液中第一类导体与第二类导体界面间的氯离子控制与铜球保养间的关联性;分析了氯离子控制不当同时铜球缺乏保养会引发品质乃至火灾事故的机理;提出了工厂应结合自身特点确定镀液控制及铜球保养方法的必要性。

If we manage the copper plating process improperly, there will be some issues in PCB production, even though caused fire accidents. This paper is to analyze the reason of a fire accident in PCB factory, it illustrates the relationship between controlling of chloride ions in the fist class conductor and second class conductor and maintaining of copper balls in the liquor of copper plating process. The reason of the fire would be the control of chloride ions improperly and lack of maintenance of cooper balls. In order to avoid the same issue in production again, the author suggests that we should base on the real station to well control the liquor concentration and maintenance of cooper balls.