摘要
盲孔孔径的减小对孔金属化工艺提出了新的挑战,盲孔孔金属化采用填铜结构可以有效提高印制电路的稳定性。文章介绍了盲孔电镀工艺中常用的四种添加剂,并对国内外填铜添加剂的研究进展进行了概述。
The new challenge of via metallization was raised because of the decreased diameter of blind via, the stability of PCB will be improved if＂bottom-up filling＂ was used for blind via metallization. In this paper, four kinds of the most frequently used additives were introduced for blind via filling, the research works of additives used for super filling was also overviewed home and abroad.
出处
《印制电路信息》
2012年第7期35-39,共5页
Printed Circuit Information
关键词
盲孔
添加剂
填铜
电镀
blind via
additive
bottom-up filling
electroplating
