SmCo薄膜的溅射法制备及其磁性能研究

Sputtering fabrication and magnetic properties of SmCo thin films

采用射频磁控溅射方法在玻璃基片上制备了SmCo磁性薄膜,并重点研究了溅射功率、溅射时间以及溅射气压等工艺参数对薄膜磁性能的影响.结果发现,当磁性层溅射功率为60 W,溅射气压为0.5Pa,溅射时间为8min,且底层溅射功率为125 W,溅射气压为0.5Pa,溅射时间为4min时,薄膜的矫顽力高达3500Oe.

SmCo magnetic thin films were prepared on water-cooled glass substrates by multigun RF magnetron sputtering system.The effect of sputtering power,sputtering time and sputtering pressure on the magnetic properties of the thin films was investigated.It is found that when the sputtering power,sputtering pressure and sputtering time of the SmCo thin films and the underlayer are 60w,0.5Pa and 8min,125w,0.5Pa and 4min,respectively,the coercivity that in the plane direction is as high as 3500Oe.The VSM measurements revealed that SmCo thin films will possess better magnetic properties with Cu as underlayer.