电子塑封材料的高温界面强度研究

Study on high temperature interfacial strength of electronic encapsulation materials

为了研究最常见的电子封装失效模式之一——高温下的界面破坏机理,在传统剪切拉拔实验的基础上进行了改良,运用焊接力测试机(Dage 4000)、拉伸机、热控制仪和热烘箱等辅助仪器,实现了电子塑封材料在高温下的界面强度测试。结果表明,界面强度随着温度的升高而降低,特别是在跨越塑封材料的玻璃转换温度时,界面强度有显著降低。比较25℃和260℃的差异可以发现,界面强度降幅接近95%。

For studying electronic packaging interfacial cracking mechanism at high temperature, one of the common failure modes in electronic packaging, the interfacial strengths of electronic encapsulation materials at high temperature were tested based on the improved traditional shearing drawing experiment by using the soldering force test machine （Dage 4000）, the drawing machine, the temperature controller and the high temperature oven. Results show that the interfacial strength decreases with the temperature increases. Especially, to across the glass transition temperature of the materials the interfacial strength decreases obviously. The strength lost is approaching 95% when the temperature is from 25 ℃ to 260 ℃.