杂环硅烷自组装膜改性的聚丙烯表面镀铜研究

Electroless copperplating on polypropylene modified by heterocyclic organosilane self-assembled nanofilm

通过在电晕放电处理的聚丙烯(PP)表面自组装6-(3-三乙氧基硅基丙基氨)-1,3,5-三嗪-2,4-二硫醇单钠盐(TES)纳米膜后,进行了化学镀铜研究。考察了施镀温度、镀液pH值对镀速的影响,施镀时间对镀层厚度的影响,确定了最优工艺参数。在优化的工艺条件下制备镀层,用扫描电镜对镀层的形貌进行分析,并做了粘接性能测试。结果表明:最佳工艺为施镀温度为50℃,pH为13,施镀时间为50 min。采用此优化工艺条件制备的镀层,表观光亮,均匀致密,与基体结合力良好。

6-（ 3-（Triethoxysilyl） propylamino ）-1,3,5-triazine-2,4-dithiol monosodium （ TES ） is used to fabricate self-assembled nanofilm on corona pretreated polypropylene （PP） surface. Then TES nanofilm modified PP is treated by electroless copperplating. The influences of the temperature, pH value and plating time on the plating copper quality are discussed. The optimal process parameters are determined. The surface morphology of the coating is characterized by SEM. The adhesion property of electroless copperplating on PP surface is measured. The optimum operating conditions are shown as follows ：50℃ of temperature, 13 of the optimum pH value and 50 minutes of plating time. The deposits obtained under the optimal technical conditions are bright, dense and uniform, and has the better adhesion between the deposits and the substrate.