摘要
分析异形微孔激光加工的现状,开展了折射式扫描系统的设计和应用研究。利用振镜电机快速改变折射式光学元件组相对激光束光轴的角度,从而精确控制激光聚焦光斑在加工面上的微小位移值。这种加工方式既保留了振镜扫描定位速度快,加工轨迹控制简便,可以实现各种异形孔加工的优势;又通过折射式光学元件组将传统反射式振镜扫描系统的几十毫米的加工范围精确缩微至几百微米,这种百倍级的光学缩微系统大幅度降低了高速振镜电机的角度分辨率、热漂移、零点漂移带来的影响,从而保证了激光加工的高精度定位和重复性。
This paper studies the state of the art of laser micro drilling and designs a new drilling system bases on laser refraction. This system replaces reflect mirrors in traditional scanning galvo by a refraction module. It can accurately control any tiny movement of laser beam on materials. This method on one hand remains high repeatability and accuracy in laser beam location, on the other strongly decreases the influences of null drift and heat drift by reducing scanning area from 10th mm's to 100th μm's. Hence, a high repeatable and accurate drilling process is engaged.
出处
《应用激光》
CSCD
北大核心
2012年第3期217-220,共4页
Applied Laser
基金
上海市科学技术委员会应用技术开发专项资金资助项目(项目编号:2010-109)
关键词
折射式扫描
平行平板
异形微孔
激光加工
refraction type scanning
parallel plate
special-shaped micro-holes
laser processing