铜离子胁迫下玉米根边缘细胞数量及存活率

The Number and Surviral Rate of Corn Root Border Cells under the Stress of Copper Ions

采用悬空培养及离体培养的方式,观察玉米的根边缘细胞在铜离子胁迫下发生的形态、数量及存活率变化情况,结果表明,在玉米根长为32mm的时候,边缘细胞的数量达到最大,为4125个,但其存活率此时最低。玉米的根边缘细胞随着铜离子浓度的增加,边缘细胞的数量发生变化。当处理浓度为50 μmol.L-1时,边缘细胞的死细胞数量达到758个(存活率为24.80%),随后铜离子处理浓度增加到100μmol.L-1时,存活率降低了17.54%。玉米根边缘细胞的数量随着铜离子浓度的增加呈现出逐渐减少的趋势,而存活率逐渐降低,说明在重金属铜离子胁迫下,根边缘细胞的释放起到对根际区域的保护作用。

By using the hanging air culture and in vitro culture with different concentrations of copper ions stress, we observed the changes of corn root border cells＇s shape, numbers and survival rates. The result showed that, when the corn root was 32 mm, the number of border cells reached a maximum of 4 125, but its survival rate was the lowest at this time. The number of border cells showed some changes accompany with the copper ions increased. When the copper concentration was 50 umol.L-1, the number of dead border cells reached 758 （the survival rate was 24.80%）. Followed by the concentration of copper ions increased to 100 umol.L-1, the survival rate declined 17.54%. The number of corn root border cells were showed an gradually reducing trend with the increase of the concentration of copper ions, the surviral rate decreased gradually. Thus, under the stress of the copper ions, the release of root border cells played the role of protection the rhizosphere region.