摘要
介绍了全自动晶圆划片机设备软件系统的设计与实现。根据设备自动化程度高,功能模块多、复用性强、耦合性强且复杂的特点,将软件系统按照层次化、模块化设计,并提出"二次封装"、界面脱离运动逻辑功能的思想。
In this paper , the design and implementation of software control system for the wafer automated dicing machine is introduced. According to the characteristic of automated Dicing machine, high coupling and complex of the function modules, the plan of software control system designing with hierarchy and afresh encapsulate were put forward.
出处
《电子工业专用设备》
2012年第6期4-6,14,共4页
Equipment for Electronic Products Manufacturing
基金
国家02重大专项课题(2002ZX02010-17)
关键词
全自动晶圆划片机
软件控制系统
二次封装
运动逻辑
Automation
Wafer
Dicing machine
Software control system
Afresh encapsulate
Logic
