摘要
键合机在工作时需要用热台将工件加热到一定温度,热台不仅要将工件加热,而且要保证加热均匀,否则会影响产品的质量。采用ANSYS对热台进行优化分析,然后通过实验分析验证,最终得出影响热台温度均匀性的因素。
Abstract：The workpiece should be heated when the wire bonding machine is working, and it is heated by the heat table,It needs to heated symmetrically.Otherwise the product qualty is affected..in this article we simulate the work state of the heat table with the software of ansys fist,then we set lot of experients,and we find the factors which affect the equal tenmpreture of the heat table at last.
出处
《电子工业专用设备》
2012年第6期7-10,共4页
Equipment for Electronic Products Manufacturing
关键词
热台
温度均匀性
热平衡
heat table tempreture equality balance of heat
