一种新型声表面波器件封装技术

A New Type of SAW Device Package Technology

声表面波器件表贴封装一直存在着技术难点,因成品率低,难以实现批量生产。通过多次实验,使用新型声表面波器件封装技术制定工艺流程,最终采用减少温度梯度,通过在环氧树脂中加入无机添加剂来降低内应力的方法,有效解决了难点问题,为批量生产打下了基础。

This paper introduces a new type of SAW device package technology. The SAW device SMD packaging of LiTaO3 has been the existence of technical difficulties, the low rate of finished products, to achieve mass production. Through many experiments, making the encapsulation process, finally by reducing the tem- perature gradient, in epoxy resin inorganic fillers to reduce internal stress method, effectively solved the techni- cal difficulties, laid a foundation for mass production.