W-Ni-Cu钨合金微波烧结试验研究

Densification of W-Ni-Cu alloy by micro-wave sintering

为研究W-Ni-Cu钨合金微波烧结致密化过程,进行不同烧结温度、保温时间、升温速度的W-Ni-Cu合金微波工艺试验。结果表明:烧结温度、烧结时间是影响W-Ni-Cu致密化的主要因素;在保证烧结温度、保温时间下,升温速度对烧结材料致密度水平的影响不明显;W-Ni-Cu合金烧结温度低于1 380℃,钨颗粒长大不明显,钨颗粒的长大不是材料致密化的主要机制。

In order to study the densification course of W-Ni-Cu alloy, the micro-wave sintering experiment of W-Ni-Cu alloy was carried out with different sintering temperatures, different holding time and different heating rates. The results show that the sintering temperature, holding time have a great influence on the density of W-Ni-Cu alloy, the heating rate is the minor factor of the sintering density. Under the temperature below 1 380 ℃, the growth of tungsten grain becomes less evident and is not the main factor of the sintering densification of W-Ni-Cu alloy.