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稀土元素对无铅钎料组织和性能的影响 被引量:36

Effect of rare earth on microstructures and properties of lead-free solders
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摘要 稀土元素以其独特的优势被称为金属材料的维他命,稀土元素的添加可以在不同程度上提高无铅钎料的性能。结合国内外在含稀土元素无铅钎料研究领域的最新研究成果,综合评论稀土元素对无铅钎料组织和性能的影响,阐述含稀土元素的无铅焊点可靠性研究现状,为该钎料的实际应用提供数据支撑,分析过量稀土元素对无铅钎料表面锡须的影响,探讨锡须的生长机制及潜在的问题,最后综合评述含稀土无铅钎料在研究过程中存在的问题以及相应的解决措施,为含稀土元素无铅钎料的研究和应用提供理论依据。 The rare earth (RE) elements due to its particular function were called the vitamin of metals, RE can greatly enhance the properties of lead-free solders in different degrees. Based on the development of lead-free solders beating RE at home and abroad, the effect of RE on the properties and microstructures of lead-free solders was reviewed systematically. The recent progress of soldered joints reliability was expatiated, which can provide data support for the application of these lead-free solders bearing RE. Through analyzing the tin whiskers of lead-free solders bearing excessive RE, the growth mechanism and possible issues were discussed. The problems and difficulty in the process of the applications of lead-free solders bearing RE were analyzed synchronously, some suggestions were put forward which maybe solve the issues mentioned above, which may provide theory guide for the investigation of lead-free solders bearing RE.
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2012年第6期1680-1696,共17页 The Chinese Journal of Nonferrous Metals
基金 江苏科技大学先进焊接技术省级重点实验室开放研究基金资助课题(JSAWS-11-03) 江苏师范大学自然科学研究基金项目(11XLR16)
关键词 稀土元素 无铅钎料 可靠性 锡须 rare earth lead-free solders reliability whiskers
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参考文献133

  • 1尹立孟,张新平.电迁移致无铅钎料微互连焊点的脆性蠕变断裂行为[J].电子学报,2009,37(2):253-257. 被引量:15
  • 2ZENG K, TU K N. Six cases of reliability study of Pb-free solder joints in electronic packaging technology[J]. Materials Science and Engineering R, 2002, 38(2): 55-105.
  • 3ZOU C D, GAO Y L, YANG B, ZHAI Q J. Melting and solidification properties of nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy[J]. Materials Characterization, 2010, 61 (4): 474-480.
  • 4GAO Li-li, XUE Song-bai, ZHANG Liang, SHENG Zhong, JI Feng, DAI Wei, YU Sheng-lin, ZENG Guang. Effect of alloying elements on properties and microstructures of SnAgCu solders[J] Microelectronic Engineering, 2010, 87(11): 2025-2034.
  • 5王丽凤,孙凤莲,吕烨,申旭伟.Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能[J].焊接学报,2009,30(1):9-12. 被引量:12
  • 6CHEN W M, YANG S C, TSAI M H, KAO C R. Uncovering the driving force for massive spalling in the Sn-Cu/Ni system[J]. Scripta Materialia, 2010, 63( 1): 47-49.
  • 7LI Xian-fen, ZHANG Fei, ZU Fang-qiu, LU Xue, ZHAO Zhen-xing, YANG Dong-dong. Effect of liquid-liquid structure transition on solidification and wettability of Sn-0.7Cu solder[J]. Journal of Alloys and Compounds, 2010, 505(2): 472-475.
  • 8SHEN J, LIU Y C, WANG D J, GAO H X. Nano ZrO2 particulate-reinforced lead-free solder composite[J]. Journal of Materials Science & Processing, 2006, 22(4): 529-532.
  • 9李仕明,余春,陆皓.锗元素对Sn-3.5Ag合金/铜界面反应的影响[J].机械工程材料,2009,33(9):21-24. 被引量:2
  • 10ZHANG L, XUE S B, GAO L L, SHENG Z, YE H, XIAO Z X, ZENG G, CHEN Y, YU S L. Development of Sn-Zn lead-free solders bearing alloying elements[J]. Journal of Materials Science: Materials in Electronics, 2010, 21(1): 1-15.

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