Chemical etching process of copper electrode for bioelectrical impedance technology

生物电阻抗铜片电极的化学刻蚀工艺(英文)

In order to obtain bioelectrical impedance electrodes with high stability, the chemical etching process was used to fabricate the copper electrode with a series of surface microstructures. By changing the etching processing parameters, some comparison experiments were performed to reveal the influence of etching time, etching temperature, etching liquid concentration, and sample sizes on the etching rate and surface microstructures of copper electrode. The result shows that the etching rate is decreased with increasing etching time, and is increased with increasing etching temperature. Moreover, it is found that the sample size has little influence on the etching rate. After choosing the reasonable etching liquid composition （formulation 3）, the copper electrode with many surface microstructures can be obtained by chemical etching process at room temperature for 20 rain. In addition, using the alternating current impedance test of electrode-electrode for 24 h, the copper electrode with a series of surface microstructures fabricated by the etching process presents a more stable impedance value compared with the electrocardiograph （ECG） electrode, resulting from the reliable surface contact of copper electrode-electrode.

为获得具有强稳定性能的生物电阻抗电极,采用化学刻蚀加工方法,制造出表面具有一系列微结构的金属铜片电极。通过改变加工工艺参数的方法,着重分析刻蚀时间、刻蚀温度、刻蚀液体浓度、样品尺寸等刻蚀工艺参数对铜片电极的蚀刻速率和表面微结构的影响。结果表明:刻蚀速率将随着刻蚀时间的延长而逐渐降低,随着刻蚀温度的升高而逐渐升高,而刻蚀样本尺寸对刻蚀速率的影响不大。选用合适的刻蚀液体浓度(组分3),在室温条件下刻蚀20min,可以获得具有丰富表面微结构的铜片电极。另外,进行24h电极对接的连续性交流阻抗测试,与心电电极相比,利用化学刻蚀加工的铜片电极,由于表面具有丰富的表面微结构,可以形成可靠的表面接触,从而具有稳定的交流阻抗值。