关于沉金镍腐蚀问题的研究

Research for nickel corrosion problem of ENIG

近年来,在无铅化的大背景下,PCB产业随之发生重大变化,表面处理工艺亦然如此。沉金工艺在诸多选择中可谓异军突起,因其固有的优点,其所占比重迅速提高,当前已经占据PCB总量的半壁江山。但沉金工艺又有其难以克服的顽疾,镍腐蚀问题就是一直困扰沉金的难题。关于镍腐蚀问题,国内外同行都做了许多方面的研究,尽管对镍腐蚀控制取得长足的进步,然而对此问题的认识、理解依旧不尽而一。实际生产中镍腐蚀问题仍是难以根除,沉金焊接性投诉还是时有发生。本章由生产实际出发结合相关实验测试,对镍腐蚀问题的关键影响因素进行了独特的探讨,分析其内在机理,以期能够帮助生产实际,为业内同行改善沉金工艺品质提供切实、有效的参考。

The PCB products had been greatly changed in the pasted few years under the demand of lead- free, so was it the surfer treatment process. The electroless nickel/immersion gold（ENIG） become more popular than the other surfer treatment process because of its advantage, and its market share was flourished. Nevertheless the ENIG also maintain some disadvantages, for example, the nickel erode was a problem that can＇t be solved for a long time. Research on the nickel erode had been made great progress with the effort of many scholars, but there were also different viewpoint that can＇t be reached an agreement, the problem was too difficult to solve that many customer complain about it. The factor of effect on nickel erode was discussed in this paper by means of some experiments connected to manufacture, and it was hope to be the technology support to improve the quality of ENIG.