多层刚挠结合印制板湿法除胶渣研究

Research on the cleaning adhesive of multilayer rigid-flex PCB through wet ways

多层刚挠结合印制板的孔内胶渣残留问题影响到孔壁内层连接的可靠性,产品经高温焊接后,容易发生孔铜与孔壁分离,导致产品功能性失效。以多层刚挠结合印制板(十六层)为案例,对比了湿法孔内胶渣除去的几种方式及其效果,为同行作参考。

The desmear of plate in hole for rigid-flex PCB mainly influence the reliability of the connection for plating-wall in hole and inner layer. After SMT, it is easy to make the plating-copper in hole and plating-wall in hole issue, so which resulted in expiration of the product function. In this paper taking the Rigid-Flex PCB for example, compared to many ways and the effect of desmear of plating in hole for Rigid-Flex PCB.