CEM-3型覆铜板用于多层板的研究

Application of CEM-3 type copper foil to copper clad laminates

由于主要原材料价格不断上涨,印制电路板市场竞争日趋激烈,促使客户以及PCB厂商不断寻求低成本材料以及生产工艺。CEM-3型覆铜板成本则相对较低,若将CEM-3型覆铜板应用于多层板制作并能满足产品品质需求,将是一个降低成本的新方法。然而传统的CEM-3型覆铜板由于材料特性限制,一般用于制作单双面板,用于多层板制作则由于其机械加工性能及可靠性等方面存在很大的制作难题,且无对应的半固化片,业内暂无此应用研究。根据CEM-3覆铜板的特性从板材的制前准备、压合参数优化、钻孔参数制定等方面进行分析试验,通过采用CEM-3基板与FR-4合适的半固化片成功压合,并制作出机械加工性及可靠性均完全符合制作标准的多层板,并成功导入批量制作。解决了行业内CEM-3板料用于多层板制作难题,降低了PCB产品的制作成本。

Because of the material cost increase in the printed circuit board market, it is necessary to promote industries low material cost products and new process. Traditional CEM-3-type CCL costs are relatively low, that if traditional CEM-3-type CCL be used in producing multilayer PCB which meets the requirement, it will be a new way to reduce costs. However, the traditional CEM-3-type CCL restricted as material properties, and generally for the production of single and double side PCB, and with the problems of machining performance and reliability, no this applied research in industries. In this paper, materials pre-condition, pressing parameter optimization, drilling parameters be analysis and tested. Press the traditional CEM-3-type CCL and FR4 prepeg together, got mulitlayer PCBs which meets the requirement of machining performance and reliability, and successfully mass product. To solve the problems of the traditional CEM-3-type CCL be used in multilayer PCB, and reducing the production costs of PCB products.