多层高频混压板叠构设计分析及压合粘结性控制

Multi-layer and high-frequency mixed-pressing PCB stackup structural design analysis and lamination adhesive control

文章通过对厂内开发的多层高频混压板在成本节约、提高弯曲强度、电磁干扰控制方面剖析其叠层结构混压设计的原理;通过对压合技术创新实现了高频混压板压合粘结性良好,保证了压合后产品可靠性无异常。

This article is about the development of multi-frequency mixed pressing PCB in cost saving; increase the bending strength and EMI control. Analysis the principle for the stackup structural mixed pressing design. Through lamination technology innovation to realize the good adhesion for high-frequency mixed pressing PCB to ensure the reliability for the product after pressing.