摘要
PCB轻、小、薄的发展趋势,对制造业提出越来越高的技术需求,尤其是精细化的工程设计和制程策划,以及进一步缩短工程资料处理周期,给生产留下更充足的加工时间,使高自动化的"PCB产前智能工程"成为目前PCB行业工程设计人员必须去探讨的课题。文章以实际参与公司"INPLAN智能工程"项目导入之方式进行简单探讨,提供未来PCB制造同行在筛选或导入"PCB产前智能工程"系统时之参考。
with PCB become lighter, smaller and thinner, the development trend of manufacturing put much higher technical requirements, especially the intensification of engineering design and process planning, and further shorten the CAM processing period, left enough time for the production processing. Make"the high automation "PCB Pre-production intelligent engineering" become the PCB industry discussing topic. Based on the actual participation in the company "Pre-production intelligent project", introduced to the ways of simple discussion. For reference of future PCB manufacturing counterparts when screening or importing "Pre-production intelligent engineering" system.
出处
《印制电路信息》
2012年第4期152-156,共5页
Printed Circuit Information
关键词
智能工程
自动化
多企业
数据交换平台
Intelligent Engineering
Automation
Multi-factories
Data Exchange Platform