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Top-down方法在功放组件结构设计中的应用 被引量:1

Application of Top-down Method in Structure Design for PA Module
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摘要 兼顾企业现有的设计环境与传统设计流程,充分发挥Top-down三维设计软件的优势,使软件的操作由一般应用向高级应用过渡。文中以雷达发射系统中功放组件结构设计为例,探讨了电子机械领域小规模装配中采用Top-down方法建模的技巧。从功放组件三维装配文件入手,以总体结构及电讯布局为原始参照,通过复制几何、引用参照、参数传递等手段,建立起相关零件特征与顶层要素之间,以及不同零件特征之间的关联,实现了装配中相关零、部件的同步再生。文中还介绍了通过直接参照顶层特征或主体零件,实现在小规模装配中运用Top-down思想的方法。采用Top-down方法,显著加快了三维装配的建模速度,提高了设计准确性,同时也方便了产品的后期调整与更改借用,达到了快速设计的目的。 Considering both existing enterprise design environment and traditional design process, exploiting the advantage of Top-down method of 3D design software, the use of software is transited from general applica- tion to advanced application. Taking the structure design of power magnifying (PA) module of radar transmit- ter system as an example, some techniques of Top-down method modeling used in electronics and machinery industry for small scale assembly are discussed in this paper. Starting from the 3D assembly document of PA module, taking total structure and the layout of electronic devices as original reference, links between features of related parts and top layer factors, and between features of different parts are established via copy geometry, reference, parameter transmission, etc. , synchronous regeneration of related parts in the assembly is realized. Another method that directly referring to top layer features or main parts, so as to realize the application of Top-down method in small scale assembly is discussed also in this paper. Using Top-down method, modeling speed of 3D assembly is increased evidently, design accuracy is enhanced. At the same time, the method also helps the post-modification and reuse of products, attaining the rapid design purpose.
作者 鲍成艳
出处 《电子机械工程》 2012年第3期44-47,共4页 Electro-Mechanical Engineering
关键词 TOP-DOWN 功放组件 三维装配 复制几何 Top-down PA module 3 D assembly copy geometry
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