摘要
随着电子产品高精度成像的需求,对印制电路板的设计与制造的要求也越来越高。这推动了PCB生产所需的曝光设备的研制。为此研发出平行光曝光设备是制作密集细线路的关键。文章介绍了平行曝光机工作原理,解析了高精密度平行光曝光机图形转移技术要点,如PCB粗糙度、贴膜、曝光、显影等。实验结果表明:可以从原来的0.127mm/0.127mm(5mil/5mil)线路能力提升到0.05mm/0.05mm(2mil/2mil)能力,实现了向精细线路的大跨越,为制作高精密度线路板提供了强大的技术基础。
As advances in electronic products with increasing demands for higher resolution of imaging, there are greater demands on printed circuit board design and fabrication. Therefore, the development of the parallel light exposure device is the key to making intensive fine line. This paper introduced the working principle of the parallel exposure machine and analyzed the high-precision parallel optical lithography pattern transfer technical points, such as roughness, film, exposure, development, etc. The results showed that from the original 5 mil/5mil ability to move 2mil/2mil line capacity. It was to achieve a big leap to fine lines and provided a strong technical foundation for the production of high-precision circuit board.
出处
《印制电路信息》
2012年第3期34-36,39,共4页
Printed Circuit Information
