两起氯离子控制不当事件的分析与处理

Analysis and processing of chloride ions accident with Improper control

在PCB制程中的电镀铜工序上,切不可忽视对电镀槽液中氯离子的浓度控制。文章主要阐述了两起氯离子控制不当事件的处理经过,分析其产生机理,验证了氯离子在镀槽内存在集聚的现象,得出了比较好的氯离子浓度控制方法。

In the copper plating process of PCB manufacturing, one thing we can not neglect is that how to well control the concentration of chloride ions in the plating bath. This paper describes how to deal with two accidents of chloride ions with improper controlling in our factory. In order to analyze the possible reasons of them, and just to validate the phenomenon of chloride ion gathering in the plating bath. From these two typical examples, then we have got some good methods on controlling the concentration of chloride ions during the process in PCB making.