摘要
致冷型红外读出集成电路经历了 2 0多年的发展 ,其技术已日臻完善 ,CMOS读出电路是当今读出电路的主流 ,其发展趋势是减小像元间距 ,增加焦平面阵列像元数而又不降低其光电性能。将滤波电路、A D转换等功能器件集成在同一芯片上也是读出电路的发展方向。
The technology of IRFPA ROIC has been developed for more tham twenty years and is becoming maturer .Now, as a main IRFPA ROIC, andCMOS IR ROIC is going to decrease the pitch and increase the number of detectors without degrading the electro optical performances.IRFPA ROIC with some functional devices,such as. A/D conversion,filter and so on,are being developed.
出处
《红外技术》
CSCD
北大核心
2000年第4期39-41,46,共4页
Infrared Technology