期刊文献+

掺砷多晶硅发射极RCA晶体管 被引量:2

Arsenic\|Doped Poly\|Silicon Emitter RCA Transistor
下载PDF
导出
摘要 研究了掺砷多晶硅发射极 RCA晶体管的工艺实验技术 .以先进多晶硅发射极器件制备工艺为基础 ,在淀积发射极多晶硅之前 ,用 RCA氧化的方法制备了一层超薄氧化层 ,并采用氮气快速热退火的方法处理 RCA氧化层 ,制备出可用于低温超高速双极集成电路的掺砷多晶硅发射极 RCA晶体管 .晶体管的电流增益在 - 55— + 1 2 5℃温度范围内的变化率小于 1 5% ,而且速度快 ,发射区尺寸为 4× 1 0μm2 的 RCA晶体管其特征频率可达 3.3GHz. The experimental technology of processing arsenic\|doped poly\|silicon emitter RCA transistor is investigated. Based on the advanced fabrication processes of poly\|silicon emitter transistor,a layer of super thin oxide is produced by using RCA oxidation before poly\|silicon of the emitter is deposited.Then the RCA oxide is treated by nitrogen rapid thermal anneal,then an arsenic\|doped poly\|silicon emitter RCA transistors applied to the high\|speed bipolar IC at low temperature are fabricated.The current gain of RCA transistor varies below 15% in the temperature range of -55—+125℃.Maximum cut\|off frequency of 3 3GHz is achieved by the RCA transistor with 4×10μm 2 emitter area.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2000年第7期697-704,共8页 半导体学报(英文版)
关键词 RCA晶体管 多晶硅发射极 掺砷 RCA transistor poly\|silicon emitter arsenic doped
  • 相关文献

参考文献5

二级参考文献9

  • 1郑茳,电子器件,1991年,14卷,44页
  • 2魏同立,电子学报,1989年,17卷,107页
  • 3格特鲁 L E,双极型晶体管模型,1981年
  • 4马平西,半导体学报,1995年,16卷,5期,443页
  • 5马平西,博士学位论文,1993年
  • 6Yu Z,IEEE Trans Electron Devices,1984年,31卷,773页
  • 7Ning T H,IEEE Trans Electron Devices,1980年,27卷,2051页
  • 8Li S S,Soid.State Electron,1978年,25卷,1109页
  • 9Li S S,Soid.State Electron,1977年,24卷,609页

共引文献5

同被引文献13

  • 1马平西,张利春,王阳元.多晶硅发射区晶体管(PET)温度特性的解析理论分析[J].Journal of Semiconductors,1996,17(2):105-112. 被引量:2
  • 2Ashburn P, Soerowirdjo B. Comparison of experimental and theoretical results on polysilicon emitter bipolar transistors. IEEE Trans Electron Devices,1984 ;ED-31 (7) : 853-860.
  • 3Post I R C, Ashburn P, Wolstenholme G R. Polysilicon emitters for bipolar transistors: a review and revaluation of theory and experiment. IEEE Trans Electron Devices, 1992; ED-39(7):1717-1730.
  • 4DeGrooff H C, DeGroot H H. The SIS tunnel emitter: a theory for emitters with thin interface layers. IEEE Trans Electron Deices, 1979;ED-26(11):1771-1776.
  • 5Zhang L C, Jin H Y, Ye H F, et al. Improvement of RCA transistor using RTA annealing after the formatin of interfacial oxide. IEEE Transactions on Electron Devices, 2002; 49(6):1075-1076.
  • 6Halen P V, Pulfrey D L. High-gain bipolar transistors with polysilicon tunnel junction emitter contacts.IEEE Trans Electron Devices, 1985 ; ED-32 (7) : 1307-1313.
  • 7Ma PX, Zhang L C, Zhao B Y, et al. An analytical model for determining carrier transport mechanism of polysilicon emitter bipolar transistors. IEEE Trans Electron Devices, 1995;ED-42(9),1789-1797.
  • 8Ma P X, Zhang L C, Wang Y Y. Analytical theory for temperature characteristics of polysilicon emitter transistors ( PET ). Chinese Journal of Semiconductors, 1996; 17(2):105-112.
  • 9Hamel J S, Roulston D J, Selvakumar C R. Trade-off between emitter resistance and current gain in polysilicon emitter bipolar transistors with intentionally grown interfacial oxide layers. IEEE Electron Device Letters, 1992;13(6) :332.
  • 10Kern W, Puotinen D. Cleaning solutions based on hydrogen peroxide for use in silicon semiconductor technology. RCA Rev, 1970 ;31-187.

引证文献2

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部