PtSi 256×256 IRCCD微型化封装技术研究

Research on Miniature Packaging Technology for PtSi 256×256 IRCCDs

采用倒装焊接技术 ,实现了PtSi 2 56× 2 56IRCCD微型化封装。对金属凸点、引线衬底的制备以及倒装焊接技术进行了研究。

Using the technology of flip-chip bonding,we realize miniature packaging for PtSi 256×256 IRCCDs. The preparation of metal bump and wire substrate have been researched,as well as flip-chip bonding technology.