摘要
采用倒装焊接技术 ,实现了PtSi 2 56× 2 56IRCCD微型化封装。对金属凸点、引线衬底的制备以及倒装焊接技术进行了研究。
Using the technology of flip-chip bonding,we realize miniature packaging for PtSi 256×256 IRCCDs. The preparation of metal bump and wire substrate have been researched,as well as flip-chip bonding technology.
出处
《半导体光电》
CAS
CSCD
北大核心
2000年第A03期59-61,共3页
Semiconductor Optoelectronics
关键词
倒装焊接
微型化封装
PTSI
PtSi IRCCD
flip-chip bonding
wire substrate
metal bump