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Impurity Effect on Wear Resistance of Ultrafine-Grained Copper

Impurity Effect on Wear Resistance of Ultrafine-Grained Copper
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摘要 The wear properties of ultrafine-grained (UFG) Cu samples of different purities were investigated in comparison with the coarse-grained (CG) Cu. The UFG Cu samples, prepared by means of plastic deformation via quasi- static compression, exhibit an enhanced wear resistance relative to the CG Cu samples. For both the UFG and the CG Cu samples, wear volumes increase at higher purities. A steady state worn subsurface structure was formed in each sample after sliding for 60 rain, consisting of a heavily deformed nanostructured mixing layer (NML) on top of a continuous dynamic recrystallization (DRX) layer. A pronounced correlation is identified that wear volume increases monotonically with an increasing grain size of the DRX layer. The impurity level of the Cu samples has an obvious influence on the DRX grain sizes, which in turn determines the wear resistance of the Cu samples. The wear properties of ultrafine-grained (UFG) Cu samples of different purities were investigated in comparison with the coarse-grained (CG) Cu. The UFG Cu samples, prepared by means of plastic deformation via quasi- static compression, exhibit an enhanced wear resistance relative to the CG Cu samples. For both the UFG and the CG Cu samples, wear volumes increase at higher purities. A steady state worn subsurface structure was formed in each sample after sliding for 60 rain, consisting of a heavily deformed nanostructured mixing layer (NML) on top of a continuous dynamic recrystallization (DRX) layer. A pronounced correlation is identified that wear volume increases monotonically with an increasing grain size of the DRX layer. The impurity level of the Cu samples has an obvious influence on the DRX grain sizes, which in turn determines the wear resistance of the Cu samples.
出处 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2012年第6期481-487,共7页 材料科学技术(英文版)
基金 support of the MOST 973 Project (Grant No.2012CB932201) Inter-national S&T Cooperation Project of China (Grant No.2010DFB54010) the National Natural Science Foundation (No.51141008) the CAS International Cooperation Project (Grant No.GJHZ1033) the CAS-Croucher Funding Scheme for Joint Laboratories and the Danish-Chinese Centre for Nanometals (Grant No.50911130230)
关键词 Ultrafine grained copper Wear resistance IMPURITY Subsurface microstructure Dynamic recrystallization Ultrafine grained copper Wear resistance Impurity Subsurface microstructure Dynamic recrystallization
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  • 1J.F. Archard: J. Appl. Phys., 1953, 24, 981.
  • 2L.G. Korshunov, A.M. Polyakova, N.L. Chernenko and V.M. Umova: Met. Metall., 1986, 61, 1007.
  • 3D.H. Jeong, F. Gonzalez, G. Palumbo, K.T. Aust and U. Erb: Scripta Mater., 2001, 44, 493.
  • 4Z.N. Farhat, Y. Ding, D.O. Northwood, A.T. Alpas: Mater. Sci. Eng. A, 1996, 206, 302.
  • 5Y.S. Zhang, Z. Han and K. Lu: Wear, 2008, 265, 396.
  • 6M.M.M. Khruschov: Wear, 1974, 28, 69.
  • 7R.C.D Richardson: Wear, 1967, 10, 291.
  • 8R.C.D Richardson: Wear, 1969, 14, 423.
  • 9B. Yao, Z. Han, Y.S. Li, N.R. Tao, K. Lu: Wear 2011, 271, 1609.
  • 10J. Weissmiiller: Nanostruct. Mater., 1993, 3, 261.

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