Ni/Ti中间层部分瞬间液相法连接C/C复合材料和GH3044

PTLP bonding C/C composites to super-alloy GH3044 with Ni/Ti interlayer

采用Ni/Ti中间层,部分瞬间液相法(Partial Transient Liquid-Phase,简称PTLP)连接C/C复合材料和GH3044,通过SEM+EDS对接头的微观结构和元素分布进行了表征,并分析了接头形成机理。研究表明,这种方法可实现C/C复合材料与中间层、中间层与GH3044界面处的良好结合;所得接头截面为GH3044/扩散层/残余Ni层/Ni-Ti金属间化合物层/炭化物反应层/C/C复合材料;随保温时间的延长,接头中金属间化合物Ni3Ti不断生长,同时两侧的Ni、NiTi被逐渐消耗。另外,因为C/C复合材料和GH3044的热膨胀系数(Coefficient of Thermal Expansion,CTE)差别很大,所以冷却过程中产生了较大的热应力,导致C/C复合材料/中间层界面附近出现了大尺寸裂纹,使接头性能下降,其剪切强度仅有9.78 MPa。

C/C composites can be jointed to super-alloy GH3044 with Ni/Ti interlayer by partial transient liquid-phase（PTLP） bonding under vacuum.Microstructures and element distribution were characterized by SEM and EDS.Interfacial structure of Ni/GH3044 diffusion layer ＋ residual Ni layer ＋ Ni-Ti intermetalics ＋ reaction layer was formed under experimental conditions.With the increase of holding time,Ni3Ti intermetalic layer between NiTi and Ni gradually grew,while NiTi and Ni were consumed.However,large-size cracks were observed near the C/C composite/interlyer interface,resulting in unsatisfactory performance of obtained joints,with the shear strength of only 9.78 MPa.