摘要
铜线键合工艺作为当前框架类集成电路封装降低成本的重要措施,但是,铜线带来的相关工艺调整和可靠性认证,以及客户的认证都是当前需要产品公司考虑的问题。本文对于铜线键合工艺和可靠性从多方面进行了研究,对该研究的发展具有借鉴和推广价值。
Copper bonding processes are the important method to cost down for frame species assembly chip. Bul copper bonding processes should carry out assembly process adjust and quality audit. And customer should accept the new assembly improvement. We research the process and reliability of the copper bonding, and the results could help the research of the field.
出处
《中国集成电路》
2012年第7期65-67,83,共4页
China lntegrated Circuit
