电镀式半加成法制作精细线路的研究

Manufacturing of Fine Lines by Semi-additive Process with Electroplating

应用电镀式半加成法制作精细线路,分别比较了HCl-CuCl2蚀刻溶液与H2SO4-H2O2微蚀溶液的蚀刻线路、铜箔厚度、直流电镀和脉冲电镀对精细线路制作质量的影响。结果表明,电镀式半加成法结合H2SO4-H2O2微蚀溶液、超薄铜箔与脉冲电镀可制作镀层厚度均匀、蚀刻效果优良与耐弯折性能的精细线路。当线宽和线距均为30μm时,电镀式半加成法制作的精细线路质量良好,因此电镀式半加成法可适用于多层印制电路、挠性印制电路与刚挠印制电路等精细线路的制作。

Semi-additive process with electroplating was used in this text for the manufacturing of fine lines.The effects of HCl-CuCl2 or H2SO4-H2O2 etching system,thickness of copper foils and direct or pulse current electroplating on the etching qualities of fine lines were studied and compared.Results showed fine lines with uniform plating thickness,fine etching effect and high flexural performance could be prepared by semi-additive process with electroplating under H2SO4-H2O2 etching system,thin copper foils and pulse electroplating.And the fine lines by semi-additive process with electroplating still had a good quality when the line width and line distance were decreased to 30 μm.So this semi-additive process with electroplating was suitable to the manufacturing of fine lines in multilayer printed circuit board,flexible printed circuit and rigid-flexible printed circuit.