摘要
键合是SMD封装中的一道重要工序,F&K 6400键合机是德国F&K公司专门面向细铝丝键合的设备,采用超声作为键合能量。在键合工艺中不同材质的金属管座会形成不同的冶金系统,有些情况下会造成接触面腐蚀或者柯肯德尔空洞,并最终影响产品的可靠性。键合时采用的超声功率、键合时间、键合压力、键合方式等工艺参数直接影响到产品的产量和性能。在批量生产的基础上,作者分析了适合F&K 6400键合机在生产中采用的键合材料及工艺参数,并列出了生产过程中设备常见的故障及可能原因。
Wire bonding is an important process in the SMD package. The 6400 bonder from F＆K corporation is an ultrasonic wedge bonder for thin aluminium wire. In wire bonding process, depending on the production requirements, different pad metallizations are used and different metallurgical system can be formed, which may cause a problem in reliability of the bonds because of interface corrosion or Kirkendall voids; bonding parameters, such as ultrosonic power, bonding time, bonding force and bonding mode, control the bonding yield and reliability directly. Based on mass production, analysis of the bonding material and process parameters for F＆K 6400 bonder used in the production, and lists the common problems and possible causes for the machine.
出处
《电子与封装》
2012年第7期6-10,共5页
Electronics & Packaging
