摘要
无铅钎料的表面张力是无铅钎料的重要物理性能之一。采用拉脱法测定Sn-0.7Cu无铅钎料的表面张力,同时采用RHEOTRONIC VШ型回转振动式高温熔体黏度仪测量Sn-0.7Cu无铅钎料黏度,通过黏度与表面张力之间的换算关系,从而计算得出Sn-0.7Cu无铅钎料表面张力。研究结果表明,Sn-0.7Cu无铅钎料表面张力随温度的增加呈现先下降后上升的变化趋势。
The surface tension is one of the most important physical properties of lead-free solder. Pulling escape method is used to test the surface tension of the Sn-0.7Cu lead-free solder. And the RHEOTRONIC VIII type tor- sional oscillation viscometer for high-temperature melts is adopted to test the viscosity of the Sn-0. 7Cu lead-free solder; the surface tension of the Sn-0. 7Cu lead-free solder is calculated through the converting relation equation between viscosity and surface tension. It is shown that the surface tension of the Sn-0. 7Cu lead-free solder firstly decreases and then increases with the temperature keeping increasing.
出处
《物理测试》
CAS
2012年第4期32-35,共4页
Physics Examination and Testing
基金
国家自然科学基金(50704009)
中央高校基本科研业务费专项资金资助(DUT11SX06)
关键词
Sn-0.7Cu无铅钎料
表面张力
拉脱法
黏度
Sn-0. 7Cu lead-free solder ； surface tension ； pulling escape method ； viscosity
