摘要
采用示差扫描量热法(DSC)和热失重分析法(TGA)研究了环氧树脂含量对氰酸酯树脂固化反应特性、热稳定性以及热膨胀系数的影响。结果表明,环氧树脂的加入可有效降低改性体系的固化反应活化能,同时体系的热稳定性和尺寸稳定性有不同程度的削弱。当环氧树脂质量分数达到20%时,改性体系的表观活化能为65.4 kJ/mol,耐热温度指数为174℃,较纯氰酸酯树脂分别降低了25.8%和21.4%。当环氧树脂质量分数达到50%时,改性体系的热膨胀系数为65.3 922×10-6/℃(25~150℃),较纯氰酸酯树脂提高了8.13%。
The effects of epoxy resin contents on the curing reaction characteristics,thermal stability and thermal expansion coefficient of cyanate resin systems were investigated by differential scanning calorimetry(DSC)and thermogravimetric analysis(TGA).The results showed that the curing activation energy was reduced effectively by the addition of epoxy resin and the thermal stability and dimensional stability were decreased in different degree.The activation energy and heat-resistant temperature index of modified system with epoxy content 20% were 65.4 kJ/mol and 174 ℃,respectively and decreased by 25.8% and 21.4% compared with that of unmodified cyanate resins.The thermal expansion coefficient of the systems with epoxy content 50% was 65.392 2×10-6/℃ at the range of 25-150 ℃ and increased by 8.13% compared with that of unmodified cyanate resins.
出处
《热固性树脂》
CAS
CSCD
北大核心
2012年第4期36-39,共4页
Thermosetting Resin
关键词
环氧树脂
氰酸酯树脂(CE)
固化反应特性
热稳定性
热膨胀系数
epoxy resin
cyanate resin(CE)
curing reaction characteristics
thermal stability
thermal expansion coefficient