聚异酰亚胺树脂合成条件的优化

Optimizing the Synthetic Conditions of Polyisoimide Resins

采用不同溶剂制备了苯乙炔基封端的聚异酰亚胺树脂,探讨了不同处理温度对聚异酰亚胺树脂(PⅡ)和相应的聚酰亚胺树脂(PⅠ)的熔体粘度及溶解性的影响。结果表明,不同处理温度对PⅡ的熔体黏度影响不大,但对溶解性有一定的影响,PⅡ在NMP和THF中具有良好的溶解性能。在相同处理温度条件下,PⅡ的熔体黏度低于PⅠ。随处理温度的增加,PⅡ低聚物的T5%随之增加,PⅡ在110℃处理的T5%为208℃,150℃处理的T5%为323℃,180℃处理的T5%为382℃,PⅡ固化后的T5%为550℃,显示出较优异的耐热性能。

Phenylethynyl end-capped polyisoimide oligomers were synthesized in different solvents. The effects of different treatment temperature on melting viscosity and solubility of polyisoimide （PⅡ） and its corresponding polyimide （P I ） resins were discussed. The results showed that the effect of treatment temperature on melting viscosity of PⅡ was marginal but conceivable on solubility. The P lI exhibited excellent solubility in N-methylpyrrolidone （NMP） and tetrahydrofuran（THF）. The P I1 had less melt viscosity than P I at same treatment temperature. The T5% of P Ⅱ oligomer increased with the elevation of treatment temperature. The T5% is 208 °C, 323 °C and 382 °C when the temperature of P Ⅱtreatment is 110 °C, 150°C and 180 °C, respectively. While the T5% of cured P Ⅱ is 550 °C suggesting that had excellent heat resistance.