摘要
Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu （SAC） solder powders, mixing with flux and reflowing at 260℃ for 60 s. The spreading areas of composite solder were calculated and the distributions of copper-coated diamonds were characterized. When diamond additions were below 3 wt%, the spreading area decreased with diamond additions, and the diamonds distributed mainly at the interface between solder and Cu pad; however, when additions were beyond 4 wt%, the discharge of diamond particle occurred, and the spreading area increased due to the reduction of surface energy.
Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu （SAC） solder powders, mixing with flux and reflowing at 260℃ for 60 s. The spreading areas of composite solder were calculated and the distributions of copper-coated diamonds were characterized. When diamond additions were below 3 wt%, the spreading area decreased with diamond additions, and the diamonds distributed mainly at the interface between solder and Cu pad; however, when additions were beyond 4 wt%, the discharge of diamond particle occurred, and the spreading area increased due to the reduction of surface energy.
基金
supported by the Scientific and Technological Development Projects in Shandong Province under Grant No.2010GGX10307
