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Modeling of void closure in diffusion bonding process based on dynamic conditions 被引量:5

Modeling of void closure in diffusion bonding process based on dynamic conditions
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摘要 The dynamic conditions for plastic deformation mechanism,surface source mechanism,interface source mechanism and creep mechanism in the diffusion bonding process are proposed.Based on these dynamic conditions,a model for void closure in the diffusion bonding process is derived.The effects of diffusion bonding parameters on the bonding mechanisms are analyzed.For the diffusion bonding process of TC4 alloy,at a low diffusion bonding temperature or pressure,or for a short time,the interface source mechanism plays a main role.But,the creep mechanism is the dominant mechanism and operates until the diffusion bonding is fulfilled.As the diffusion bonding time increases,the surface source and interface source mechanism enhance and then stop at a certain stage of diffusion bonding,while the creep mechanism enhances continuously.As the diffusion bonding temperature or pressure increases,the interface source mechanism weakens and the other mechanisms enhance.The maximum and average errors between the calculated and the experimental results in the diffusion bonding for TC4 alloy are 12.86% and 5.79%,respectively.
出处 《Science China(Technological Sciences)》 SCIE EI CAS 2012年第9期2420-2431,共12页 中国科学(技术科学英文版)
基金 supported by the National Natural Science Foundation of China (Grant No. 50975234)
关键词 diffusion bonding dynamic condition VOID MODEL TC4 alloy 扩散连接工艺 工艺建模 孔隙 塑性变形机制 扩散接合 TC4合金 蠕变机制 震源机制
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