化学机械抛光液的发展现状与研究方向

Research Status and Prospect of Chemical Mechanical Polishing Slurry

简述了化学机械抛光液的主要成分及其作用;综述了近年来国内外化学机械抛光液的发展现状,主要介绍了二氧化硅胶体抛光液、二氧化铈抛光液、氧化铝抛光液、纳米金刚石抛光液。最后指出,化学机械抛光液未来应向环保化、精细化以及专门化的方向发展。

The main composition and function of chemical mechanical polishing （CMP） slurry were elaborated. The developing status of CMP surry in recent years was summarized . It mainly introduced SiO2 sol polishing slurry, Al2 O3 polishing slurry, CeO2 polishing slurry , nanodiamond polishing slurry. Finally, the research trends of CMP slurry were pointed out which were environmental protection, refinement, hyperspecialization.