PCB锡膏图像采集参数的研究

Solder Paste Image Acquisition Parameters of the PCB

利用图像处理技术对锡膏进行检测是锡膏检测中的一种新方法,图像质量是确保图像检测精度的关键之一。图像采集对于保障图像质量来说有着至关重要的作用,是最终获取图像有用信息所进行的一系列处理步骤中关键的第一步。重点研究了影响锡膏图像采集的焦距、曝光、增益三个主要参数,并通过实验确定了焦距、曝光和增益等三个主要参数的合理取值范围以及快门速度与增益之间的函数关系。为锡膏图像采集参数的调整提供了依据,也为后续研究锡膏图像采集的参数自动调整奠定了基础。

Detection of solder paste by image processing is a new approach in the solder paste inspection, image quality is one of the keys to ensure the accuracy of image detection. The image acquisition is a vital role for the protection of image quality. It＇s also a critical step in a series of processing steps to eventually obtain images useful information. This paper focuses on three main parameters of focal length, exposure and gain affecting the quality of solder paste image acquisition. The experimental demonstration of the reasonable range of the three main parameters of the focus, exposure and gain. As well as the functional relationship between shutter speed and gain. Providing a basis for the adjustment of solder paste image acquisition paramenters, but also laid the foundation for the follow-up study for parameters adjustment automatically of the paste image acquisition.