摘要
利用光学显微镜、扫描电镜分析了Q235B中厚板的表面孔洞缺陷,认为该缺陷是皮下气泡,孔洞周围有较大的夹杂物。Q235B中厚板表面产生皮下气泡的原因是氩气流量不合理,通过调整结晶器流场、降低氩气流量,Q235B中厚板的孔洞缺陷大幅降低,产品质量明显提高。
The surface holes on Q235B plate are analyzed with optical microscope and scanning electron microacope.It is considered those are air bubbles under surface with much inclusion around.The reason to cause it is unreasonable flow amount of argon.With adjusting mold flow field to reduce argon flow amount,the holes reduced to a large extent,product quality rather improved.
出处
《河北冶金》
2012年第7期56-58,共3页
Hebei Metallurgy
