摘要
运用有限元分析软件ANSYS,对含有非完全阵列分布电子元器件的电子设备的稳态温度场分布进行了研究,分析了导致设备过热的主要原因,并根据分析结果对其内部电子元器件的布局进行了优化。结果表明:通过改变电子元器件的位置,电子设备的最高温度和平均温度分别降低了9.914%和9.838%,可靠性得到了提高。
The steady-state temperature field of a device containing some incompletely arrayed electronic components were studied using a finite element analysis software ANSYS. The main reasons for the overheating of the device were analyzed, and the layout of those incompletely arrayed electronic components was optimized based on the analysis. The results show that the maximum temperature and the average temperature of the device are reduced by 9.914% and 9.838% respectively through optimizing the layout of electronic components. This indicates that the reliability of the device is improved by the layout optimization.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2012年第8期69-71,共3页
Electronic Components And Materials
基金
国家自然科学基金资助项目(No.61031001
No.60972118)
北京市创新人才资助项目(No.PHR201106226
No.PHR201006115)
科技创新平台资助项目(No.71F1210907
No.5028123300)
"十二五"预先研究资助项目(No.40405100304
No.9071223301)
关键词
非完全阵列
可靠性
稳态温度场
热布局优化
incomplete array
reliability
steady-state temperature field
thermal layout optimization
