摘要
介绍了SMT工艺中最常见的一种BGA焊接不良的原因分析。以一款客诉PCB BGA焊接不良为例对其产生的原因进行分析和讲解,最终寻找到导致该款PCB BGA焊接不良的真正原因,并针对焊接不良问题提出了相应的改善措施,突出了SMT过程中的具体控制技巧。为同行业进行SMT工艺提供一定的参考依据。
Introduce reason analysis of a kind of poor soldered BGA in SMT.Analyze the real reason of poor soldered BGA in SMT based on a type of PCB with poor soldered BGA that the customer complained,and finally found the real reason that led to poor soldered BGA.Aiming at the poor soldering problems,put forward the corresponding measures of improvement.Provide the reference for the engineer in the same industry.
出处
《电子工艺技术》
2012年第4期211-214,237,共5页
Electronics Process Technology
关键词
SMT
BGA
PCB
焊接不良
Surface mounted technology
Ball grid array
Printed circuit board
Poorly soldering
