中频磁控溅射技术制备Co-Ni合金薄膜

Deposition and Characterization of Co-Ni Alloy Films by Mid-Frequency Magnetron Sputtering

由于电镀硬铬对环境有一定的污染，因而选择合适的制备方式和合适的替代硬铬的材料具有一定的实际意义。本文选用Co-Ni作为硬铬的替代材料，并采用中频磁控溅射的方式在铜基底上制备Co-Ni合金薄膜，重点研究了溅射功率与Co-Ni合金薄膜的沉积速率、成分的关系，结果表明沉积速率随溅射功率的增加而增加；溅射功率在O．8-1．1kW之间时，薄膜成分与靶材成分基本一致；并把1．1kW时制备的Co-Ni合金薄膜的电极化腐蚀性能与电镀cr薄膜、离子镀Cr薄膜相比较，结果表明Co-Ni合金的腐蚀电位可达到-0．245V，具有较强的耐腐蚀性。

The Co-Ni alloy films were deposited on copper substrate by mid-frequency magnetron sputtering to find an environmental friendly alternative to hard chrome coating. The impacts of the deposition conditions, including the sput- tering power, deposition rate, pressure and gas flow rates,on microstructures and properties of the Co-Ni alloy films were evaluated. The films were characterized with X-ray diffraction, atomic force microscopy and electrochemical analysis. The results show that the sputtering power strongly affects the film growth, and that the Co-Ni films display a fairly higher cor- rosion resistance than that of Cr plating. For example, the deposition rate increased with an increase of the sputtering pow- er.At 0.8 - 1.1 kW, the frlm contents are almost identical to those of the target. The corrosion resistance of the Co-Ni films,grown at 1.1 kW,is much higher than that of both the electroplated and ion-plated Cr films;and the corrosion po- tential of the Co-Ni films reaches up to -0.245 V.