摘要
微细电铸的Over-plating过程对电铸成型金属器件的质量有直接影响。通过有限元方法对微细电铸过程的电场进行建模分析,利用迭代边界法对Over-plating动态过程的阴极电流密度分布进行数值模拟;通过对直径300μm、深100μm微孔结构的电铸实验,得到了不同时间下Over-plating过程的电铸层形貌;实验结果与数值模拟有着很好的一致性,表明基于有限元的迭代边界分析方法是合理的,也为后续对微细电铸Over-plating成型过程的定量分析提供了参考。
Shaping process of Over-plating has a direct effect on quality of the metal device acquired by micro-eleetroforming. Finite element method is employed to model and analyze upon electric field of micro-eleetroforming process, meanwhile iteration boundary method is taken advantage of to implement numerical simulation on catholic current density distribution of Over-plating dynamic process;by means of electroforming experiment on micro-hole with diameter 300 p^m, depth lOOp.m, eleetroforming layers with some profile of Over-plating process have been obtained at different time;experimental outcome has a good agreement with numerical simulation results, which proves that iteration boundary method based on finite element method is rational, also lays the foundation for the quantitative analysis on Over-plating process of micro-electroforming.
出处
《现代制造工程》
CSCD
北大核心
2012年第8期21-25,共5页
Modern Manufacturing Engineering
基金
国家863高技术计划资助项目(2006AA04Z311)
安徽省自然科学基金资助项目(11040606M109)
