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Etching Mechanisms of CF_3 Etching Fluorinated Si:Molecular Dynamics Simulation

Etching Mechanisms of CF_3 Etching Fluorinated Si:Molecular Dynamics Simulation
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摘要 Molecular dynamics simulations are performed to investigate CF3 continuously bom- barding the amorphous silicon surface with energies of 10 eV, 50 eV, 100 eV and 150 eV at normal incidence and room temperature. The improved Tersoff-Brenner potentials were used. The simulation results show that the steady-state etching rates are about 0.019, 0.085 and 0.1701 for 50 eV, 100 eV and 150 eV, respectively. With increasing incident energy, a transition from C-rich surface to F-rich surface is observed. In the region modified by CF3, SiF and CF species are dominant. Molecular dynamics simulations are performed to investigate CF3 continuously bom- barding the amorphous silicon surface with energies of 10 eV, 50 eV, 100 eV and 150 eV at normal incidence and room temperature. The improved Tersoff-Brenner potentials were used. The simulation results show that the steady-state etching rates are about 0.019, 0.085 and 0.1701 for 50 eV, 100 eV and 150 eV, respectively. With increasing incident energy, a transition from C-rich surface to F-rich surface is observed. In the region modified by CF3, SiF and CF species are dominant.
出处 《Plasma Science and Technology》 SCIE EI CAS CSCD 2012年第7期670-674,共5页 等离子体科学和技术(英文版)
基金 supported financially by Guizhou Province of China(No.700968101) International Thermonuclear Experimental Reactor(ITER) program special(No.2009GB104006)
关键词 molecular dynamics simulation amorphous silicon incident energy molecular dynamics simulation, amorphous silicon, incident energy
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