摘要
Solder interconnects reliability during drop impact is important for portable electronic products. In this paper, board level drop impact tests were conducted according to the standard of the Joint Electronic Devices Engineering Council （JEDEC）. Solder failure drop numbers were recorded and solder failure analyses were carried out. A high speed data acquisition system was constructed to measure the printed cireuit board （ PCt~ ） dynamic response during the impact. Measured response data were used to characterize the loading feature of the impact. The relatioT~~hip between solder failure features and PCB dynamic response was correlated. Solder failure mechanisms were discussed. The correlation of PCB strain data with the solder failure life indicates that the solder damage accumulated during drop impact is dependent on both strain amplitude and modes contribution of the PCB. Compared with high strain amplitude loading condition, lower strain amplitude with higher mode can even produce more severe damage to the solder interconnects. Repeated impact loadings to the solder induce the combination failure mechanism of both impact and fatigue. Failure analyses results provide convincing verification for the complexity of the failure mechanisms.
Solder interconnects reliability during drop impact is important for portable electronic products. In this paper, board level drop impact tests were conducted according to the standard of the Joint Electronic Devices Engineering Council （JEDEC）. Solder failure drop numbers were recorded and solder failure analyses were carried out. A high speed data acquisition system was constructed to measure the printed cireuit board （ PCt~ ） dynamic response during the impact. Measured response data were used to characterize the loading feature of the impact. The relatioT~~hip between solder failure features and PCB dynamic response was correlated. Solder failure mechanisms were discussed. The correlation of PCB strain data with the solder failure life indicates that the solder damage accumulated during drop impact is dependent on both strain amplitude and modes contribution of the PCB. Compared with high strain amplitude loading condition, lower strain amplitude with higher mode can even produce more severe damage to the solder interconnects. Repeated impact loadings to the solder induce the combination failure mechanism of both impact and fatigue. Failure analyses results provide convincing verification for the complexity of the failure mechanisms.
基金
Supported by National Natural Science Foundation of China （No. 51075107
No. 51174069） and Key Project of Natural Science Foundation of Heilongjiang Province （No. ZD200910）.
