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改性PPE及高速PCB基材

The modified PPE For higher transmission speeds PCB base materials
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摘要 本文介绍了新发明的一种树脂配方,把诺伏拉克型萜烯酚树脂和引发剂加入到聚苯醚中,使PPE的分子量降得较低,因而能形成较高的交联密度;而且双马来酰亚胺/环氧树脂/聚苯醚的不同用量比例,可形成半互穿聚合物网络结构;从而提高了实验产品的玻璃化温度、耐热性及耐溶剂性能。 The paper introduces a new resin composition invented, wherein the phenol resin is terpene phenol resin or dicyclopentadiene phenol resin. Other additives, such as curing agent, catalyst or inorganic particle additive can be added as well, based on requirements. According to the invention, terpene novolac resin and initiator (peroxide) are added in polyphenylene ether so that molecules are rearranged to form a PPE resin having lower molecular weight and higher crosslinking density. Furthermore, BMI/epoxy resin/PPE are combined in different weight percentages. Semi-interpenetrating polymer network structures are thus formed. Consequently, Tg and resistances both to heat and solvent of the resin are increased.
作者 张洪文
出处 《覆铜板资讯》 2012年第4期32-35,共4页 Copper Clad Laminate Information
关键词 聚苯醚 双马来酰亚胺 巴比妥酸 环氧树脂 玻璃化温度 介电常数 介质损耗 互穿聚合物网络结构 polyphenylene ether, bismaleimide, barbituric acid, epoxy resin, glass transition temperature, dielectric constant,dissipation factor, interpenetrating polymer network structures
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