低温低膨胀系数高硬度无铅电子玻璃粉

Lead-Free Electronic Glass Powder with Properties of Lower Sintering Temperature and Lower Expansion Coefficient and Higher Hardness

叙述了低温低膨胀系数无铅电子玻璃粉研制过程。当Bi2O3的质量分数在60%,B2O3在10.7%,ZnO在21.3%,SiO2在5%,其它成分在3%时,可获得膨胀系数为(55～62)×10-7/℃,软化点为380～385℃,玻化温度在450±10℃,附着力优良的无铅玻璃粉。

The Lead-free electronic glass powder with properties of lower sintering temperature,lower expansion coefficient and higher hardness was briefly introduced.The results show that this glass powder can be obtained when it contains 60% Bi2O3,10.7% B2O3,21.3% ZnO,5% SiO2 and 5% other oxides.The glass made from this powder has the properties of thermal expansion coefficient within the range of（55-62）×10-7/℃,softening point within 380~385℃,sintering temperature about 450±10℃ and also has high adhesive strength.