高性能树脂基体的最新研究进展

Progress of High-Performance Thermosetting Resins

高性能热固性树脂是航空航天、交通及微电子等领域重要的基础材料。本文论述了国内外主要的高性能热固性树脂,如双马来酰亚胺树脂、聚酰亚胺树脂、氰酸酯树脂、邻苯二甲腈树脂、聚三唑树脂和有机/无机杂化树脂的研究和应用现状,并提出相应的发展趋势。

High-performance thermosetting resins are the important material for aerospace,traffic and microelectronic field etc. The research on high-performance thermosetting resins, such as bismaleimide resin, polyimide resin, cyanate ester resin, phthalonitrile resin, polytriazole resin and organic/inorganic hybrid resins, and their applications are discussed in terms of their advantages and features, difficulties and key technologies to be solved, and future devel- opment trends and directions.