期刊文献+

硅基大位移低驱动电压静电微驱动器变形分析 被引量:2

Analysis of the Si micro actuator with large displacement and low voltage
下载PDF
导出
摘要 针对目前横向加载单向变形静电微驱动器存在的位移过小或驱动电压过大的问题,提出一种基于纵横弯曲变形原理的硅基大位移低电压静电微驱动器模型,将弹性力由传统意义的恢复力改变为驱动力,推导出微驱动器挠度变形的控制方程.通过仿真发现,该驱动器的驱动位移高达145μm,远大于目前微驱动器的变形量;驱动电压仅为5V,远低于目前微驱动器的驱动电压值. The development trend of the micro actuator is the large-displacement, low-voltage and fast response. At present, the main drive mode of the micro actuator is the electrostatic transverse loading. However, its drive voltage is too high and deformation is too small. The model of a micro actuator with large displacement low voltage is presented based on the principle of the vertically-horizontally bending. The elastic force is transformed from the restoring force to the driving force. The deflection equation of the micro beam is derived. Simulation shows that the displacement is as large as 145μm and the driving voltage is as low as 5 V. The displacement and driving voltage are superior to those of the current micro actuator.
出处 《西安电子科技大学学报》 EI CAS CSCD 北大核心 2012年第4期109-113,共5页 Journal of Xidian University
基金 国家自然科学基金资助项目(61176130) 教育部基本科研业务费资助项目(JY10000904016)
关键词 微电子机械系统 微驱动器 纵横弯曲 挠度方程 MEMS micro actuator vertically-horizontally bending deflection equation
  • 相关文献

参考文献9

  • 1赵剑,贾建援,王洪喜,张文波.双稳态屈曲梁的非线性跳跃特性研究[J].西安电子科技大学学报,2007,34(3):458-462. 被引量:10
  • 2侯智昊,刘泽文,李志坚.DC~30GHz并联接触式RF MEMS开关的设计与制造[J].光学精密工程,2009,17(8):1922-1927. 被引量:6
  • 3董乔华,廖小平,黄庆安,黄见秋.RF MEMS开关吸合电压的分析[J].Journal of Semiconductors,2008,29(1):163-167. 被引量:6
  • 4Mahameed R, Rebeiz G. A High-power Temperature-stable Electrostatic RF MEMS Capacitive Switch Based on a Thermal Buckle-beam Design [J]. Journal of Microelectromechanical Systems, 2010, 19(4) : 819-830.
  • 5Srinivasan P, Gollasch C, Kraft M. Three Dimensional Electrostatic Actuators for Tunable Optical Micro Cavities [J]. Sensors and Actuators A, 2010, 161(1) : 191-198.
  • 6Gaspar J, Schmidt M, Pedrini G. Out of Plane Electrostatic Micro Actuators with Tunable Stiffness[R]. Hong Kong: 2010 IEEE 23rd International Conference on MEMS, 2010: 1131-1134.
  • 7田文超.微机电技术(MEMS)原理、设计与分析[M].西安:西安电子科技大学出版社,2009.
  • 8Vitushinsky R, Sehmitz S, Ludwig A. Bistable Thin-film Shape Memory Actuators for Applications in Tactile Displays [J]. Journal of Microelectromechanical Systems, 2009, 18(1): 186-195.
  • 9朱应敏,贾建援,田文超,樊康旗.永磁微加速度开关设计与仿真[J].西安电子科技大学学报,2007,34(2):285-289. 被引量:4

二级参考文献27

  • 1贾建援,樊康旗,王洪喜,朱应敏.基于两态稳定性原子级存储方式的分子动力学模拟[J].西安电子科技大学学报,2005,32(5):729-732. 被引量:1
  • 2剧锦三,蒋秀根,郭彦林,陈杰.拱结构的弹塑性二次分岔屈曲性能[J].工程力学,2006,23(9):12-17. 被引量:4
  • 3徐泰然.MEMS和微系统--设计与制造[M].北京:机械工业出版社,2004.
  • 4Griffin W S,Richardson H H,Yamanami S.A Study of Squeeze Film Damping[J].ASME Journal of Basic Engineering,1966,(6):451-456.
  • 5Timoshenko S,Goodier J N.弹性理论[M].北京:高等教育出版社,1990:489-495.
  • 6Pruitt B L,Park W T,Kenny T W.Measurement System for Low Force and Small Displacement Contacts[J].Journal of Microelectromechanical System,2004,13(2):220-229.
  • 7Michaelis S,Timme H J,Wycisk M,et al.Additive Electroplating Technology as a Post-CMOS Process for the Production of MEMS Acceleration-threshold Switches for Transportation Applications[J].Journal of Micromechanics and Microengineering,2000,10(2):120-123.
  • 8Ma W,Zohar W,Wong M.Design and Characterization of Inertia-activated Electrical Micro-switches Fabricated and Packaged Using Low-temperature Photoresist Molded Metal-electroplating Technology[J].Journal of Micromechanics and Microengineering,2003,13(6):892-899.
  • 9Sabariego R V,Gyselinck J,Dular P,et al.Coupled Mechanical-electrostatic FE-BE Analysis with FMM Acceleration:Application to a Shunt Capacitive MEMS Switch[J].The International Journal for Computation and Mathematics in Electrical and Electronic Engineering,2004,12(23):876-884.
  • 10Akoun G,Yonnet J.3D Analytical Calculation of the Forces Exerted Between Two Cuboidal Magnets[J].IEEE Trans on Magnetics,1984,20(5):1 962-1 964.

共引文献21

同被引文献15

  • 1McMillan K.Symbolic Model Checking:an Approach to the State Explosion Problem[D].Pittsburgh:Carnegie Mellon University,1993.
  • 2Mahameed R,Rebeiz G M.A High-Power Temperature-Stable Electrostatic RF MEMS Capacitive Switch Based on a Thermal Buckle-Beam Design[J].IEEE Journal of Microelectromechanical Systems,2010,19(4):816-826.
  • 3Gaspar J,Schmidt M,Pedrini G.Out-of-plane Electrostatic Microactuators with Tunable Stiffness[C]//IEEE International Conference on Micro Electro Mechanical Systems.Piscataway:IEEE,2010:1131-1134.
  • 4Srinivasan P,Gollasch C,Kraft M.Three Dimensional Electrostatic Actuators for Tunable Optical Microcavities[J].Sensors and Actuators A:Physical,2010,161(1):191-198.
  • 5Yu Y,Yuan W,Qiao D.Electromechanical Characterization of a New Micro Programmable Blazed Grating by Laser Doppler Vibrometry (LDV)[J].Micro System Technology,2009,15(6):853-858.
  • 6Zhang L X, Zhao Y P. Electromechanical model of RF MEMS switches [ J]. Microsystem Technologies, 2003, 9:420 -426.
  • 7Srinivasan P, Gollasch C, Kraft M. Three dimensional electrostatic actuators for tunable optical microcavities [ J]. Sensors and Actuators A,2010,161( 1 ) :191 - 198.
  • 8Samy A, David E. Experimental validation of electromechanical buckling [ J]. Journal of Microelectromechanical Systems, 2006,15 (6) : 1656 - 1672..
  • 9Mahameed R, MRebeiz G. A high-power temperature-stable electrostatic RF MEMS capacitive switch based on a thermal buckle-beam design [ J]. IEEE Journal of Microelectromechanical Systems,2010,19(4) :816 - 826.
  • 10Gaspar J, Schmidt M, Pedrini G. Out-of-plane electrostatic microactuators with tunable stiffness [ C ]ffIEEE 23rd International Conference on Micro Electro Mechanical Systems. Hong kong, China, 2010 : 1131 - 1134.

引证文献2

二级引证文献3

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部