摘要
针对无线射频识别(RFID)封装设备导电胶热压固化模块,温控系统通道多、相互独立、控制参数整定复杂等特点,提出了简化参数整定且兼顾系统性能的先进控制策略:内模控制(IMC)。仿真和实验结果表明:将内模PID控制策略应用于RFID导电胶热压固化工艺中,能够有效提高温度控制品质。
To solve the problems of multi-channel temperature control,independence of each channel and complexity of the controlling parameter tuned in conductive adhesive hot curing of RFID packing equipment,the article presents advanced control strategy IMC to simplify the system parameters,but not to lower its performance.Simulation and experimental results show that IMC PID in RFID hot curing process can be applied in improving control quality effectively.
出处
《机械制造与自动化》
2012年第4期206-208,共3页
Machine Building & Automation
基金
国家科技支撑计划项目(2009BAF10B04)
