等离子体处理对织物表面溅射铜膜性能的影响

Effect of plasma treatment on Cu thin films deposited on polyester fabric

利用直流磁控溅射法,在涤纶织物表面沉积纳米铜薄膜,研究氧、氩等离子体处理前后涤纶基材表面沉积铜膜的形貌、导电性能和润湿性能的变化。以扫描电子显微镜(SEM)和原子力显微镜(AFM)观察低温等离子体处理前后纤维表面的粗糙度和纳米铜颗粒大小变化,并对表面沉积纳米铜织物导电性能、润湿性能进行测试,结果表明,氧等离子体处理对涤纶基材表面的影响较氩等离子体明显,其可使纳米铜颗粒分布均匀致密,显著增加纤维表面的粗糙度和纳米铜颗粒大小,明显提高纳米铜膜导电性能。处理后,液滴在样品表面接触角变小,镀铜织物亲水性能得到明显改善。

The copper thin films with nano structure are prepared on the surface of polyester plain weave fabric by DC （ direct current ） magnetron sputtering at room temperature, and the changes in the morphology, electrical properties and wettability of the nano-structured copper thin film before and after oxygen and argon plasma treatment are investigated. The particle sizes and surface roughness of the as-deposited and plasma treated copper thin films are characterized by AFM （atomic force microscope） and SEM（scanning electron microscopy）, electrical property and wettability of the copper-deposited samples are also analyzed. The results show that oxygen plasma treatment has more obvious etching effect on the polyester substrate than argon plasma, which makes the better uniformity and compactness of copper film, larger particle sizes, higher surface roughness of copper thin films, and enhanced electrical properties of copper-deposited samples. The contact angle of the water droplet on the sample is relatively smaller and the wettability of copper-deposited fabric is markedly improved with the treatment of oxy- gen plasma.